Address: Room 201, Block B, Jinfulai Building, 49 Dabao Road, Dalang Community, Xin 'an Street, Bao 'an District, Shenzhen
Telephone: 0755-21502916
Mobile Phone:18018792906
Fax: 0755-27925952
Email address:market@ahk-china.com
Website: www.ahk-china.com
一、存储温度测试标准 A、高温贮存试验 试验目的:检验产品在高温环境条件下贮存的适用性 试验设备:恒温恒湿试验箱 试验样品:5SETS 试验内容:被测产品不包装、不通电,(en)
温度循环试验主要是利用不同材料热膨胀系数的差异,加强其因温度快速变化所产生的热应力对试件所造成的劣化影响。当电子组件经受温度循环时,内部出现交替膨胀和收缩,使其产生热应力和应变。如果组件内部邻接材料的热膨胀系数不匹配,这些热应力和应变就会加剧,在具有潜在缺陷的部位会起到应力提升的作用,随着温度循环的不断施加,缺陷长大并最终变为故障(如开裂)而被发现,这称为热疲劳。对于电子组件而言,其内部元器件一般(en)
高低温实验是产品可靠性的必测项目,那么高低温对产品到底有哪些影响?<p helvetica="" neue",="" "pingfang="" sc",="" "hiragino="" sans="" gb",="(en)
Japanese chip designer ARM is attracting interest from graphics chipmaker Nvidia, according to foreign media reports, sources familiar with the matter said. People familiar with the matter said Nvidia had approached ARM in recent weeks about a potential deal.People familiar with the matter also said other potential bidders could emerge. Mr Son's SoftBank has been reported to be exploring the sale of some or all of its stake in ARM through a private deal or a public listing.People familiar with the matter said Nvidia's interest was unlikely to lead to a deal and that SoftBank could still pursue an ARM listing.Representatives for SoftBank, Arm and Nvidia declined to comment.